ImmerCom 2023
The 1st ACM Workshop on Mobile Immersive Computing, Networking, and Systems
To be held in conjunction with ACM MobiCom 2023
October 6, 2023, Madrid, Spain
Steering Committee
- Songqing Chen, George Mason University, USA
- Charlie Hu, Purdue University, USA
- Klara Nahrstedt, University of Illinois at Urbana-Champaign, USA
- Lili Qiu, University of Texas at Austin, USA
- Anthony Rowe, Carnegie Mellon University, USA
Program Co-chairs
- Bo Han, George Mason University, USA
- Robert LiKamWa, Arizona State University, USA
- Feng Qian, University of Minnesota, USA
Web Chair
- Puqi Zhou, George Mason University, USA
Publicity Chair
- Ruizhi Cheng, George Mason University, USA
Technical Program Committee
- Özgü Alay, University of Oslo, Norway
- Bhojan Anand, National University of Singapore, Singapore
- Kittipat Apicharttrisorn, Nokia Bell Labs, USA
- Dimitris Chatzopoulos, University College Dublin, Ireland
- Bo Chen, University of Illinois at Urbana-Champaign, USA
- Jiasi Chen, University of Michigan, USA
- Eduardo Cuervo, Google, USA
- Mallesham Dasar, Carnegie Mellon University, USA
- Jeroen Famaey, University of Antwerp, Belgium
- Huber Flores, University of Tartu, Estonia
- Sebastian Friston, University College London, UK
- Tian Guo, Worcester Polytechnic Institute, USA
- Sokol Kosta, Aalborg University, Denmark
- Guillaume Lavoué, École Nationale d'Ingénieurs de Saint-Étienne, France
- Youngki Lee, Seoul National University, South Korea
- Xiaoli Liu, University of Helsinki, Finland
- Jiayi Meng, Purdue University, USA
- Mario Montagud, University of Valencia & i2CAT Foundation, Spain
- Niall Murray, Athlone Institute of Technology, Ireland
- Xiuquan Qiao, Beijing University of Posts and Telecommunications, China
- Sanja Scepanovic, Nokia Bell Labs, UK
- Amit Sheoran, AT&T, USA
- Ashiwan Sivakumar, AT&T, USA
- Xiang Su, Norwegian University of Science and Technology, Norway
- Sheng Wei, Rutgers University, USA
- Di Wu, Sun Yat-sen University, China
- Hui-Yin Wu, Inria, France
- Zehui Xiong, Singapore University of Technology and Design, Singapore
- Ding Zhang, Amazon, USA